23/10/09
PoP masterclass to show how the only way is up
OEMs and designers from across the UK will gather in South Wales next month (Nov) to hear how cutting-edge Package on Package (PoP) technology can transform their operations and competitiveness.
Top electronics consultant, Bob Willis, will host a one-day workshop in POP assembly, rework and inspection at leading contractor manufacturer, Axiom Manufacturing Services, to explain the major space-saving and processing speed advantages of PoP.
Axiom is currently the only mainstream CEM in Britain using PoP manufacturing techniques, which involves the stacking of semiconductors directly on top of each other to facilitate smaller final units, higher-speed processing and improved reliability.
PoP technology can eliminate circuitry to reduce the board space required by up to 43% and enable higher-speed processing, given that memory and processor components are positioned in much closer proximity.
It can benefit OEMs across many sectors from makers of handheld point-of-sale devices and office equipment to medical devices, high-end scientific instruments or battlefield communications kit.
The convergence of communications, IT and consumer electronics has increased demand for the miniaturisation of devices such as mobile phones and PDAs. PoP not only allows for greater flexibility in designs without the constraints of the size of the PCB it also allows faster processing to increase functionality.
Axiom has grasped the POP opportunity through investment in a Fuji AIM Surface Mount Technology (SMT) machine which can place PoP components at a rate of eight seconds per device.
Rob Taylor, senior engineer at Axiom, said: "POP technology is rapidly becoming an attractive choice for OEMs and designers. It's ideal for anyone involved in the production of hand-held devices with high functionality requiring faster processing speeds.
"Axiom has taken a lead in the UK in the application of this technology but the advantages are so significant that we believe it will rapidly become a mainstream choice for product designers.
"In Japan they are already looking at stacking three and four components on top of each other. This is usually a clear indication of where technology is heading so we are expecting a big increase in demand for POP over the coming months," he added.
Mr Taylor said: "Our confidence in PoP is reflected in our investment in a DAGE 7600 XiDAT digital X-Ray inspection system, capable of inspecting multi-level BGAs. We also sent a team to Fuji in Hungary to see the manufacturing equipment in action before making the decision to purchase the feeder."
The workshop takes place on Tuesday 24 November 2009 at the Axiom's facility in Newbridge, south Wales.
The event is aimed at design, production and quality engineers looking at future technology and topics include the benefits of PoP stack packages, lead-free assembly, PoP placement and a practical session on re-work and inspection.
Workshop facilitator, Bob Willis, said: "The application of PoP technology is a new area for many UK-based designers and OEMs but it's clear from the success in Japan that its popularity is growing. As real estate is at a premium for logic and memory, PCB designers are saying the only way to go is up and up.
"The workshop will provide the perfect opportunity for assembly engineers to gain a deeper understanding of the technology and see it in operation at Axiom."
More information can be found at www.askbobwillis.com/PoPworkshops.pdf.
